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CM1230
PACKAGE DIMENSIONS
PIN A1
REFERENCE
D
A
B
E
WLCSP4, 0.96x0.96
CASE 567CS
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
2X
2X
0.05 C
0.05 C
TOP VIEW
A2
DIM
A
A1
A2
b
D
E
e
MIN MAX
0.61 0.69
0.21 0.28
0.41 REF
0.29 0.34
0.96 BSC
0.96 BSC
0.50 BSC
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.05 C
NOTE 3
SIDE VIEW
C
SEATING
PLANE
A1
PACKAGE
OUTLINE
4X b
0.05 C A B
0.03 C
B
e
e
0.50
PITCH
0.50
4X
0.25
A
1 2
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
WLCSP6, 1.46x0.96
CASE 567BB
ISSUE O
PIN A1
REFERENCE
D
A
B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
TOP VIEW
2X
2X
0.05 C
0.05 C
OptiGuard Option
A2
DIM
A
A1
A2
b
D
E
e
MIN MAX
0.56 0.72
0.21 0.27
0.42 REF
0.29 0.35
1.46 BSC
0.96 BSC
0.50 BSC
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.05 C
NOTE 3
SIDE VIEW
C
SEATING
PLANE
A1
PACKAGE
OUTLINE
6X b
0.05 C A B
0.03 C
B
e
e
0.50
PITCH
0.50
6X
0.25
A
1 2 3
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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